测控溅射
来自内部开发和制造的核心技术

我们最重要的核心技术之一是磁控溅射。在这一工艺中,镀膜材料离开固体靶材并转移到基片上。

这是通过真空中的磁场增强气体放电来实现的。这种放电会产生等离子体,即电子和正气体离子的混合物。带正电的离子在电场的作用下被加速到作为阴极连接的靶材表面。这会将单个原子撞出靶材表面。

这些原子凝聚在基片(例如玻璃)上,并形成功能层。基片连续移动经过磁控溅射源(动态镀膜),或者在蒸气流中暴露一段时间(静态镀膜)。在动态镀膜中,膜层的厚度由从靶材去除材料的速率和基片通过的速度决定。在静态镀膜中,停留时间决定厚度。

磁控溅射可用于多种金属和陶瓷镀膜材料。根据工艺的不同,可以非常有效地沉积厚度高达几百纳米的复杂镀膜,并且在大面积上实现高度均匀性。根据应用,使用管状或平面靶材,其长度可以根据待镀膜基片的宽度调整。

磁控管是冯阿登纳的核心部件。  冯阿登纳开发和制造磁控管。这使我们能够将我们从数百个已交付的镀膜设备和部件中获得的广泛知识结合起来。

如需了解更多详细信息,请单击以下内容或直接联系我们。

 

非常广泛的工艺知识,

适用于各种溅射应用

在小面积和大

面积上沉积高度均匀的复杂膜层系统

来自内部开发

和制造的不同磁控管类型的广泛产品组合

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